The DeepRecon module leverages custom-trained neural networks to enable higher throughput and higher success rates for FA and structural analysis applications requiring repetitive analysis of samples that are the same or similar to each other. ZEISS offers customized neural networks for specific sample classes that can be optimized to meet customer needs. Compared to FDK, DeepRecon enables scans up to four times faster with similar or better image quality for designated sample classes, as well as superior image quality with low noise when using the same scan time. Minimal effort is required to apply the desired DeepRecon network model for the workflow. The tool operator simply selects one of the ZEISS-developed network models from a drop-down menu.
“Since its introduction last year, the ZEISS Xradia 600-series Versa has seen strong momentum in the electronics and semiconductor packaging industry due to its superior resolution, image quality and throughput for package failure analysis,” stated Dr. Stefan Preuss, head of ZEISS Process Control Solutions. “As our customers continue to face new challenges in advanced package failure analysis, ZEISS in turn is continually innovating to bring new capabilities and higher levels of performance to our products in order to meet those challenges head on. A case in point is our Advanced Reconstruction Toolbox with OptiRecon and DeepRecon modules, which provides a significant boost to throughput and image quality for these world-class imaging solutions – enabling our customers to accelerate their time to results and achieve higher package yields even more than before.”
The ZEISS Advanced Reconstruction Toolbox with OptiRecon and DeepRecon modules are now available for upgrade on ZEISS Xradia Versa systems and ZEISS Xradia Context microCT systems, as well as future Versa and Context microCT systems.
For more information on the ZEISS Advanced Reconstruction Toolbox and other 3D X-ray imaging solutions from ZEISS, please visit: www.zeiss.com/pcs
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